SiGe Semiconductor Appoints Fred Shlapak as Chairman of the Board
June, 2007—Methuen, Massachusetts and Ottawa, Ontario
SiGe Semiconductor, a global leading supplier of radio frequency (RF) front-end solutions for wireless systems, today announced the appointment of Fred Shlapak as chairman of the Board of Directors. Shlapak’s addition expands the Board to seven members.
“We are honored that Fred has joined our Board of Directors,” said SiGe Semiconductor CEO Sohail Khan. “He brings over three decades of leadership and operational experience coupled with deep knowledge of the semiconductor industry. His perspective will be invaluable as we continue to grow our market share in RF components for a broad range of wireless applications. We’re in an exciting period for the company as we leverage our experience in GPS, and WiFi to penetrate the emerging opportunity for fixed and mobile WiMax.”
Shlapak was president and chief executive officer of the Semiconductor Products Sector at Motorola Corporation when he retired in February 2004. Shlapak's 33-year career at Motorola included leading the company's Canadian semiconductor operations. Later, Shlapak moved to Europe where he had roles of increasing responsibility that culminated with leadership of Motorola's European Semiconductor Group. Shlapak holds B.S. and M.S. degrees in Electrical Engineering from the University of Waterloo.
Shlapak also serves on the boards of Applied Micro Circuits Corporation (NASDAQ:AMCC), Gennum Corporation (TSX: GND) and Tundra Semiconductor Corporation (TSX:TUN).
SiGe is at the forefront of wireless technology, providing components that enable a broad range of wireless LAN, GPS and Bluetooth devices including mobile phones, PDAs, laptops, wireless data equipment and GPS receivers. With over 170 million SiGe solutions in the market already and shipping rates of approximately 20 million a quarter, SiGe continues to supply the world’s leading technology companies including Dell Computer, Apple Computer, Lenovo, Nintendo, Samsung and Motorola.
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